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I think the answer is that the PCF use-case only uses a subsection of Digital Twin Kit. The difference in {
"interface": "SUBMODEL-3.0",
"protocolInformation": {
"href": "https://edc.data.plane/mypath/submodel",
"endpointProtocol": "HTTP",
"endpointProtocolVersion": [
"1.1"
],
"subprotocol": "DSP",
"subprotocolBody": "id=123;dspEndpoint=http://edc.control.plane/api/v1/dsp",
"subprotocolBodyEncoding": "plain",
"securityAttributes": [
{
"type": "NONE",
"key": "NONE",
"value": "NONE"
}
]
}
} Here, the However, the PCF use-case works differently. They use the data in the |
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When we compared the KITs for Digital Twin, Industry Core and PCF Exchange we detected a difference in the Submodel description for a Digital Twin, related to the attribute "interface". In the Digital Twin KIT the interface "SUBMODEL-3.0" is used, whereas in the PCF Exchange KIT another interface, "PCF-1.0.0" is used.
As the Digital Twin KIT describes a standard, or at least a recommendation, it is confusing to find a deviation in the PCF Exchange KIT that is also referring to the Digital Twin KIT.
It seems there are reasons why different "interface" types have been chosen.
In my opinion, It would be helpful to get an explanation in the Digital Twin KIT what the field "interface" means and if alternatives to "SUBMODEL-3.0" are expected and how they should be handled.
In addition, the PCF Exchange KIT should then explain why a different "interface" has been chosen and what it actually means.
What do you think?
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